Surfaces

CCTC Corporation uses all solderable surfaces required all over the world in its production program. OSP and ENIG mixed surfaces are a particularity. It is, according to the current state of the art for solderable BGAs, the safest surface with the best soldering yield for BGAs. The BGA soldering points are treated with OSP.

  • OSP
  • ENIG
  • Selective ENIG+OSP
    (Special surface for BGA soldering)
  • Gold contacts
  • Immersion Tin
  • Immersion Silver
  • Leadfree HAL
  • Carbon Print
  • Peelable mask
Item Mass Production Try Run
HASL ( u") Average >100 >300
ENIG Min Ni ( u") 100≤X≤200 X>200
Min Au ( u") 1.2≤X≤2.0 2.0≤4.0
OSP ( um ) 0.25≤X≤0.5 0.35≤X≤0.5
Immersion-Silver ( u") 6≤X≤18  
Immersion-Tin( um ) 0.8≤X ≤ 1.0 1.0≤X ≤ 1.2
Electrolyte Ni/Au Min Ni ( u") ≤150 >150
Min Au ( u") Etching resistance 1≤X≤2 2≤X≤3
Gold Finger Min Ni ( u") ≤160 160≤200
Min Au ( u") ≤35 35≤70
Peelable blue ink ( mm ) ≤0.2 0.2≤0.3
Carbon ink ( um ) 15 ± 5 20 ± 5





Information

  • We have moved
    Recently, the CCTC Europe GmbH moved to a new office at Erlangen.

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