Multilayer

CCTC manufactures multilayer boards with 4 to 28 layers in all variations and combinations in Plants I and II. From FR4 standard to Teflon usage, via the high Tg laminates.

Plant II HDI, with a yearly capacity of 500.000 m², is specialized on advanced multilayer and laser technologies. The productions in Plants I and II, both in Shantou, are organized for the large volume production of the automotive or the telecommunication industries as well as for the smaller volumes, for example, of the aviation, the medical technology and the mechanical engineering sectors.

Micro sections:

Item Mass Capability Test Capability note
HDI structure 1+1+1+N+1+1+1 1+1+1+1+N+1+1+1+1  
Core material FR4 FR4  
Core thickness ≥0.10 mm    
Build up material RCC, LDP   Prefer LDP
Build up dielectric T 0.05-0.127 mm    
Micro-via type Stack hole, Microvia on Microvia 1-3, Microvia on IVH  
Blind via filling Resin fill,Cu fill    
Blind hole process method Large Window, Conformal Mask, Copper Direct    
Item Parameters Illustration Mass Capability Test Capability
Finished hole size Min. Hole Size 0.20 mm  
Max. 6.50 mm  
Laser drill hole size (A) Min. 0.10 mm  
Max. 0.15 mm  
Duplicate Holes Hole Size Do not allow
Touching Holes Hole Size Do not allow (need statement in case of slot)
Extra Holes Hole Size Do not allow
Missing Holes Hole Size Do not allow
P/G Shorts Check   Do not allow
Item Mass Capability Test Capability Remark
Max. dimension 24 x 18" 40 x 30"  
Layers ≤40 ≤50  
Layer to Layer alignment ≤2mil    
Warp & Twist 0.5%   Exclude unbalance layout or stackup.
Max. AR 10:1 16:1  
Hole wall Cu (Ave.) ≤0.98mil >0.98mil  
Min. Dielectric Thickness 2.0mil    
Core Thickness 0.1-2.5mm 0.075-2.4mm Innlerlayer Cu =1OZ
Finished board thickness 0.25-5mm 0.2-10mm  
Item Mass Capability Test Capability
Line width tolerance Line width ≥ 10mil ± 2mil ± 1mil
4mil ≤ Line width ≤ 10 mil ± 20% ± 15%
Line width <4mil ± 1mil ± 20%
Single-ended impedance 28 ≤ impedance < 50O ± 20%  
50 ≤ impedance ≤100O ± 10%  
>100O ± 8%  
differenctial impedance 28 ≤ impedance < 50O ± 20%  
50 ≤ impedance ≤ 100O ± 10%  
> 100O ± 12%  
Item Mass Capability Test Capability note
Alignment ±2 mil ±1.5mil  
thickness On surface 0.40 - 1.57mil Line edge>0.7mil  
On laminate 0.30 - 0.70mil  
Non-block capability (drill size) T≤1.20mm ≥0.30mm ≥0.25mm  
1.2mm<T≤2.0mm ≥0.35mm ≥0.30mm  
Developing capability (drill) ≥0.40mm   With S/M clearance
Process method   Spray coating  
Soldermask Type Taiyo PSR4000 Halogen free soldermask  
color Green, blue    

Usage concept

The production format of printed circuit producers is mainly related to the basis material format provided on the market by the suppliers.

The resulting production formats for printed board manufacturers are therefore usually one quarter or one sixth of these formats, without cutting error. For example: USA format for basis material vendors = 1220 x 920 mm, one quarter of this format = 610 x 460 mm (production format of the printed circuit producers). The highly automated plants seldom operate with more than six different formats, which all basis material formats are reproduced all over the world with, without cutting error.

The sophisticated fabrication of printed circuits, like CCTC’s, are optimally designed and adjusted, in all cost relevant and format related processes, according to these production formats. Only this way can a high quality fabrication standard be guaranteed.

The production format surface, that is effectively usable by the customer, is also called « net surface ». It is the surface without the processing overhead that is necessary for the press systems, the resin fluxes, the capture systems for the press processes, the test systems etc... Each printed circuit producer has processing overhead dimensions that are slightly different according to his own production.

To reach optimal costs and therefore prices, the usable format defined by the customer should correspond, considering the net surface and without cutting error, to a multiple of the formats that are exploited by the printed circuit producers.

Taking for example into account the interspaces = cutter diameter, or without interspace with the scoring technique.

The higher the percentage of material usage is, the lower the cost per delivered dm² and, as a consequence, the better the price. A positive effect on the environment and for the ecology is achieved thru less waste production. The required format tables will be provided on request to the customer fabrication department.

Panel-Design

Materials

Item Current 2010 2011
Mass
Production
Try Run Mass
Production
Try Run Mass
Production
Try Run
Resin System
FR-4 Normal Tg Yes --- Yes --- Yes ---
FR-4 Middle Tg Yes --- Yes --- Yes ---
FR-4 High Tg Yes --- Yes --- Yes ---
Halogen Free FR-4 Yes --- Yes --- Yes ---
Rogers Yes --- Yes --- Yes ---
BT Yes --- Yes --- Yes ---
Polyimide Yes --- Yes --- Yes ---
RCC and Prepreg
Normal Epoxy Yes --- Yes --- Yes ---
Halogen Free Epoxy Yes --- Yes --- Yes ---
Prepreg(recommended) Yes --- Yes --- Yes ---
Current Supplier 1. Shengyi; 2. Panasonic; 3. Goworld; 4. ITEQ; 5. Grace; 6. Rogers; 7. Nelco; 8. Arlon; 9.MGC;
10. LG Chemical

Surfaces

  • OSP
  • ENIG
  • Selective ENIG+OSP
    (Special surface for BGA soldering)
  • Gold contacts
  • Immersion Tin
  • Immersion Silver
  • Leadfree HAL
  • Carbon Print
  • Peelable mask

Information

  • We have moved
    Recently, the CCTC Europe GmbH moved to a new office at Erlangen.

    We look forward to your visit!

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